金彩汇 Nano silver powder:

金彩汇 High performance conductive filling material with good oxidation resistance. Used for conductivity, electromagnetic shielding, antibacterial and antivirus in electronic pastes and electronic products.

金彩汇 main features

1. Silver powder has low porosity and good fluidity;

The surface of the conductive layer of silver powder powder is flat and has good conductivity;

3 high-performance conductive filling materials with good antioxidant properties. Used for conductivity, electromagnetic shielding, antibacterial and antivirus purposes in electronic pastes and electronic products.

金彩汇 application area

1. Thin film and ultrafine fiber;

金彩汇 2. ABS, PC, PVC and other plastic substrates;

3 Antibacterial and antibacterial agents;

4. Used as high-temperature sintered conductive silver paste and low-temperature polymer conductive silver paste;

5 ultra-fine silver powder: with an average particle size of 0.4 microns, this series of silver powder is mainly suitable as a conductive filler for high-temperature sintered conductor slurries. By combining this series of silver powder, different sintering goals can be achieved, and it can also be used for special purposes such as catalysts and antibacterial materials; Silver powder is mainly used as a conductive filler for conductive coatings, conductive inks, and polymer conductive silver pastes; It is a high-performance conductive filling material with good antioxidant properties. It is used for conductivity, electromagnetic shielding, antibacterial and antivirus purposes in electronic pastes and electronic products.